Talantix.io
Winbond•28.02.26
AI SCORE 8.5

Senior CIM MCU/​SoC IC Design Engineer - Remote Opportunity

$120K–$150K/year
RemoteSemiconductor Design
I&C Design•SOC Design•CIM Technology•Verification•Integration•Electrical Engineering

About the Role

We are seeking a talented and experienced Senior CIM MCU/SoC IC Design Engineer to join our innovative team at Winbond. This is a remote opportunity where you will play a crucial role in designing and developing CIM-based SoCs and modules. Your expertise will directly contribute to the advancement of our semiconductor technology.

What You'll Do

  • Design CIM SoCs and modules, ensuring high performance and reliability.
  • Develop modules for CIM-based SoCs, focusing on integration and verification processes.
  • Collaborate with cross-functional teams to enhance SoC design methodologies.
  • Conduct thorough testing and validation of SoC designs to meet industry standards.
  • Utilize advanced tools and technologies for SoC design and verification.

Requirements

  • Master's degree in Electrical Engineering or a related field.
  • Minimum of 5 years of relevant experience in IC design.
  • Proficient in English, with advanced communication skills.
  • Strong understanding of SoC design, integration, and verification processes.
  • Experience with CIM technology and related tools is a plus.

Nice to Have

  • Familiarity with industry standards and best practices in semiconductor design.
  • Experience in project management and leading design teams.
  • Knowledge of emerging technologies in the semiconductor field.

What We Offer

  • Competitive salary ranging from $120,000 to $150,000 per year.
  • Flexible remote work environment.
  • Opportunities for professional growth and development.
  • Collaborative and innovative team culture.
  • Comprehensive benefits package including health insurance and retirement plans.
Language Requirements
EnglishC1
BasicIntermediateAdvancedNative
Why This Job8.5 of 10

This role offers a unique opportunity to work remotely as a Senior CIM MCU/SoC IC Design Engineer at Winbond, a leader in semiconductor technology. With a competitive salary and a focus on innovation, this position is ideal for experienced engineers looking to make an impact.

Salary Range
Required
0/1
Optional
0/1
Bonus
0/1

Who Will Succeed Here

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Proficient in I&C Design and CIM Technology with hands-on experience using tools such as Cadence or Synopsys for SoC design and integration.

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Self-motivated and disciplined remote worker, able to manage time effectively and communicate asynchronously with team members across different time zones.

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In-depth understanding of verification methodologies, such as UVM (Universal Verification Methodology), with a track record of successfully leading projects from concept to production in the semiconductor field.

Learning Resources

→ASIC Design and Verificationcourse
→System-on-Chip (SoC) Designcourse
→Introduction to Semiconductor Technologyarticle

Career Path

Senior CIM MCU/SoC IC Design Engineer(Now)→Lead IC Design Engineer(1-2 years)→Director of IC Design(3-5 years)

Market Overview

Market Size 2024
$15.2B
Annual Growth
8.5%
AI Adoption in IC Design
35%
Investment in Semiconductor Technology
+50%
Labour Demand for CIM Engineers
+25%
Avg Salary for Senior IC Engineers
$140K

Skills & Requirements

Required
I&C DesignSOC DesignCIM Technology
Growing in Demand
Machine Learning for IC DesignAdvanced Verification Techniques (UVM)FPGA Design and Implementation
Declining
VHDL for Basic DesignTraditional Static Timing Analysis

Domain Trends

Rise of AI-Driven Design Tools
AI tools are increasingly being integrated into IC design processes, with 35% of companies adopting AI solutions to enhance design efficiency and reduce time-to-market.
Shift Towards 5nm and Smaller Nodes
The industry is moving towards smaller process nodes, with over 60% of new designs targeting 5nm or smaller, necessitating advanced design techniques and tools.
Increased Focus on Energy Efficiency
Energy-efficient designs are becoming critical, with 70% of companies prioritizing low-power solutions in their IC design projects to meet global sustainability goals.

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